POSITIVE PHOTORESIST COMPOSITION, THICK LAYERED PHOTORESIST, PROCESS FOR PRODUCING THICK RESIST PATTERN, AND PROCESS FOR PRODUCING CONNECTING TERMINAL

摘要

A positive photoresist composition which can form a thick resist pattern having high sensitivity. The positive photoresist composition comprises (A) a compound which generates an acid upon irradiation with actinic rays or a radiation and (B) a resin whose alkali solubility increases by the action of an acid, wherein the ingredient (B) comprises a resin (B1) having a constituent unit (b1) which is a constituent unit derived from an acrylic ester and in which the hydrogen atom of the carboxy group has been replaced with an acid-dissociable dissolution-inhibitive group represented by the following general formula (I). [Chemical formula 1] (I) [In the formula, Y represents an optionally substituted alicyclic group or alkyl; n is an integer of 0-3; and R1 and R2 each independently represents hydrogen or C1-5 alkyl.]