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METHOD OF SIMULATING A POST-EXPOSURE-BAKE (PEB) PROCESS IN A LITHOGRAPHIC PROCEDURE

机译:在光刻工艺中模拟曝光后烘烤(PEB)过程的方法

摘要

The present invention relates to a method of simulating a post-exposure-bake (PEB) process in a lithographic procedure to obtain a concentration distribution M as a concentration dependent on location x and time t of an inhibitor in a photoresist that comprises at least one acid, a quencher and an inhibitor and is applied to a wafer, with the following steps: preparing an initial concentration A0, Q0 and M0 respectively of an acid, a base and an inhibitor; determining the concentration distribution M of the inhibitor, A of the acid and Q of the base from a chemical potential µ, which is obtained as a solution of a parabolic variational inequality based on at least one of the prepared initial concentrations A0, Q0 and M0.
机译:本发明涉及一种在光刻工艺中模拟曝光后烘烤(PEB)工艺以获得浓度分布M的方法,该浓度分布M取决于在光刻胶中抑制剂的位置x和时间t的浓度,该浓度包括至少一个通过以下步骤将酸,淬灭剂和抑制剂施用于晶片上:分别制备酸,碱和抑制剂的初始浓度A0,Q0和M0;根据化学势μ确定抑制剂的浓度分布M,酸的A和碱的Q,化学势μ是根据所制备的初始浓度A0,Q0和M0中的至少一个作为抛物线变化不等式的溶液而获得的。

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