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PROCESS PERTURBATION TO MEASURED-MODELED METHOD FOR SEMICONDUCTOR DEVICE TECHNOLOGY MODELING

机译:半导体器件技术建模的测量建模方法的过程扰动

摘要

A method for modeling semiconductor devices which utilize a measured-to-modeled microscope as a fundamental analysis basis for constructing a physically-based model by correlating measured model performance changes to experimental device changes designed to controllably change physical aspects of the advise. The effects of the process perturbation can then be attributed to changes in measurable internal characteristics of the device. With thorough process perturbation to measured model PM2 experimentation, the full range of device performance can be expressed in terms of the microscopes model-basis space, thus forming a single unified compact device technology model, able to accurately model measured performance changes over a relatively wide range of possible physical and environment changes to the device. The model is able to model internal device physical device operating mechanisms that are critical to the device technology, such as charge control in FET's or current control in BJT's.
机译:一种用于对半导体器件进行建模的方法,该方法利用实测模型显微镜作为基础分析基础,通过将实测模型性能变化与设计用来可控地改变建议的物理方面的实验设备变化相关联来构建基于物理的模型。然后,过程扰动的影响可以归因于设备可测量内部特性的变化。通过对测量的模型PM 2实验进行彻底的过程扰动,可以用显微镜的模型基础空间来表示设备性能的全部范围,从而形成一个统一的紧凑型设备技术模型,能够准确地模拟整个过程中的测量性能变化。设备可能发生的相对较大的物理和环境变化。该模型能够对对设备技术至关重要的内部设备物理设备操作机制进行建模,例如FET中的充电控制或BJT中的电流控制。

著录项

  • 公开/公告号EP1290718A4

    专利类型

  • 公开/公告日2007-01-10

    原文格式PDF

  • 申请/专利权人 NORTHROP GRUMMAN CORPORATION;

    申请/专利号EP20010930752

  • 发明设计人 TSAI ROGER S.;

    申请日2001-04-25

  • 分类号H01L21/00;H01L21/66;G01R31/26;

  • 国家 EP

  • 入库时间 2022-08-21 20:49:44

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