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High temperature annealing of spin coated Pr(1-x)Ca(x)MnO3 thin film for RRAM application

机译:RRAM应用中旋涂Pr(1-x)Ca(x)MnO3薄膜的高温退火

摘要

A method of forming a PCMO thin film in a RRAM device includes preparing a substrate; depositing a metal barrier layer on the substrate; forming a bottom electrode on the barrier layer; spin-coating a layer of Pri-xCaxMnO3 (PCMO) on the bottom electrode using a PCMO precursor; baking the PCMO thin film in one or more baking steps; annealing the PCMO thin film in a first annealing step after each spin-coating step; repeating the spin-coating step, the baking step and the first annealing step until the PCMO thin film has a desired thickness; annealing the PCMO thin film in a second annealing step, thereby producing a PCMO thin film having a crystalline structure of Pr1-xCaxMnO3, where 0.2=X=0.5; depositing a top electrode; patterning the top electrode; and completing the RRAM device.
机译:在RRAM器件中形成PCMO薄膜的方法包括:准备基板;在基板上沉积金属阻挡层;在阻挡层上形成底部电极;使用PCMO前体在底部电极上旋涂Pri-xCaxMnO3(PCMO)层;在一个或多个烘烤步骤中烘烤PCMO薄膜;在每个旋涂步骤之后的第一退火步骤中使PCMO薄膜退火;重复旋涂步骤,烘烤步骤和第一退火步骤,直到PCMO薄膜具有所需的厚度为止;在第二退火步骤中对所述PCMO薄膜进行退火,从而制备具有Pr1-xCaxMnO3的晶体结构的PCMO薄膜,其中0.2≤X≤0.5。沉积顶部电极;构图顶部电极;并完成RRAM设备。

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