METAL MATERIAL FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, ELECTRONIC DEVICE, METHOD FOR PROCESSING METAL MATERIAL, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND ELECTRO-OPTICAL COMPONENT

摘要

Provided are an electronic component, an electronic device, a metal alloy material used for such products, method for processing electronic and metal materials, and an electro-optical component. For instance, a metal alloy material for electronic components, which is applicable to liquid crystal display elements, various types of semiconductor products and components, printed wiring boards and other IC chip components and the like, and has a resistivity lower than conventional ones, and furthermore, has superiority in manufacturing process, is stable and excellent in workability, is provided. An electronic component and an electronic device using such metal material are also provided. An alloy, which has Cu as a main ingredient and contains 0.1-7.0wt% of W and 0.1-3.0wt% of one or a plurality of elements selected from a group composed of Al, Au, Ag, Ti, Ni, Co and Si, in total, is applied as the metal material. By using such metal material, weather resistance of the entire Cu is improved by homogeneously mixing Mo with grain boundary of Cu by adding W to Cu.