SCHEDULE CONTROL METHOD IN SPIN ETCHING AND SPIN ETCHING SYSTEM

摘要

A schedule control method in spin etching and a spin etching system in which uniform etching amount can be realized when a wafer is etched under various conditions and etched wafers have a uniform thickness. Weight of a wafer is measured, before etching, on a 1/1000g basis and then specified etching is carried out at a spin etching section. Weight is measured again on a 1/1000g basis following a rinsing/drying process, an actual etching amount is calculated from the difference between weights before and after etching the wafer, and an etching rate of etching liquid is confirmed every time to control an etching time.