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WAFER TRANSFER HAVING COOLING FUNCTION AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INSTALLED THE SAME
WAFER TRANSFER HAVING COOLING FUNCTION AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INSTALLED THE SAME
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机译:具有相同功能的晶圆传送装置和冷却装置,并且具有相同的半导体制造设备
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摘要
A wafer transfer having a cooling function and a semiconductor manufacturing device with the same are provided to reduce a process time of a thin film deposition. A plurality of wafers are loaded on a wafer boat(130). A reaction tube includes the wafer boat. The wafer boat is inserted in a process tube(120). A boat elevator(150) provides the wafer boat in the reaction tube. A wafer transfer(160) transfers a wafer of the wafer boat to an outside or an external wafer to the wafer boat. A cooling gas injection unit(167) is included in the wafer transfer, and injects cooling gas to a wafer side of the wafer boat so that the wafer of the wafer boat is cooled. The cooling gas injection unit includes a gas injection cylinder, a gas injection piston, and a gas injection head. The gas injection cylinder is provided at the wafer transfer. The gas injection head engages with an end of the gas injection piston and injects cooling gas to a wafer side.
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