首页> 外国专利> WAFER TRANSFER HAVING COOLING FUNCTION AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INSTALLED THE SAME

WAFER TRANSFER HAVING COOLING FUNCTION AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INSTALLED THE SAME

机译:具有相同功能的晶圆传送装置和冷却装置,并且具有相同的半导体制造设备

摘要

A wafer transfer having a cooling function and a semiconductor manufacturing device with the same are provided to reduce a process time of a thin film deposition. A plurality of wafers are loaded on a wafer boat(130). A reaction tube includes the wafer boat. The wafer boat is inserted in a process tube(120). A boat elevator(150) provides the wafer boat in the reaction tube. A wafer transfer(160) transfers a wafer of the wafer boat to an outside or an external wafer to the wafer boat. A cooling gas injection unit(167) is included in the wafer transfer, and injects cooling gas to a wafer side of the wafer boat so that the wafer of the wafer boat is cooled. The cooling gas injection unit includes a gas injection cylinder, a gas injection piston, and a gas injection head. The gas injection cylinder is provided at the wafer transfer. The gas injection head engages with an end of the gas injection piston and injects cooling gas to a wafer side.
机译:提供具有冷却功能的晶片传送器和具有该晶片传送器的半导体制造装置以减少薄膜沉积的处理时间。多个晶片被装载在晶片舟皿(130)上。反应管包括晶片舟皿。晶片舟皿插入处理管(120)中。舟皿升降器(150)在反应管中提供晶片舟皿。晶片传送器(160)将晶片舟皿的晶片传送到外部,或者将外部晶片传送到晶片舟皿。晶片传送器中包括冷却气体注入单元(167),该冷却气体注入单元将冷却气体注入到晶片舟皿的晶片侧,从而冷却晶片舟皿的晶片。冷却气体注入单元包括气体注入缸,气体注入活塞和气体注入头。气体注入缸设置在晶片传送器处。气体注入头与气体注入活塞的端部接合并将冷却气体注入到晶片侧。

著录项

  • 公开/公告号KR20060127695A

    专利类型

  • 公开/公告日2006-12-13

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20050049033

  • 发明设计人 SHIN HEE SEOK;

    申请日2005-06-08

  • 分类号H01L21/20;H01L21/02;

  • 国家 KR

  • 入库时间 2022-08-21 20:42:31

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