INTERFEROMETRIC MODULATOR WITH REDUCED SLIPPAGE BETWEEN STRUCTURES AND METHOD OF MAKING THE INTERFEROMETRIC MODULATOR

摘要

A support structure (18) within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure (18) and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure (18) and a substrate layer (20). In another embodiment, increased adhesion is achieved between a support structure (18) and a moveable layer (14). Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.