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CAPACITOR LAYER-FORMING MATERIAL AND PRINTED CIRCUIT BOARD HAVING INTERNAL CAPACITOR CIRCUIT OBTAINED BY USING CAPACITOR LAYER-FORMING MATERIAL

机译:电容器层形成材料和印刷电路板具有使用电容器层形成材料获得的内部电容器电路

摘要

The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.
机译:目的是提供用于形成电容器层的材料,该材料在介电层和电容器电路的底部电极内的粘附性优异。并且提供一种用于形成电容器层的材料,该电容器层具有用于形成底部电极的新的导电层,该底部电极能够用作还用作电阻电路等的电极。为了解决该问题,本发明提供了一种导电层,其中在铜层或镍-磷合金层,纯镍层和镍的表面上依次沉积有纯镍层和镍-磷合金层。 -磷合金层按顺序沉积在铜层的表面上,以确保电容器电路的底部电极和在顶部电极和底部电极之间具有电介质层的印刷线路板中的电介质层之间的优异粘附性。

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