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CAPACITOR LAYER-FORMING MATERIAL AND PRINTED CIRCUIT BOARD HAVING INTERNAL CAPACITOR CIRCUIT OBTAINED BY USING CAPACITOR LAYER-FORMING MATERIAL
CAPACITOR LAYER-FORMING MATERIAL AND PRINTED CIRCUIT BOARD HAVING INTERNAL CAPACITOR CIRCUIT OBTAINED BY USING CAPACITOR LAYER-FORMING MATERIAL
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机译:电容器层形成材料和印刷电路板具有使用电容器层形成材料获得的内部电容器电路
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摘要
The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.
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