首页> 外国专利> SILICON-ON-INSULATOR SEMICONDUCTOR DEVICE WITH SILICON LAYER HAVING DEFFERENT CRYSTAL ORIENTATIONS AND METHOD OF FORMING THE SILICON-ON-INSULATOR SEMICONDUCTOR DEVICE

SILICON-ON-INSULATOR SEMICONDUCTOR DEVICE WITH SILICON LAYER HAVING DEFFERENT CRYSTAL ORIENTATIONS AND METHOD OF FORMING THE SILICON-ON-INSULATOR SEMICONDUCTOR DEVICE

机译:具有不同的晶体取向的硅层的绝缘体上硅半导体器件以及形成绝缘体上硅半导体器件的方法

摘要

A semiconductor device comprising a substrate 12 having a first crystal orientation and an insulating layer 40 overlying the substrate 12 is provided. A plurality of silicon layers 16, 30 are formed overlying the insulating layer 40. A first silicon layer 16 comprises silicon having the first crystal orientation and a second silicon layer 30 comprises silicon having a second crystal orientation. In addition, a method of forming a semiconductor device providing a silicon-on-insulator structure comprising a substrate 12 with a silicon layer 16 overlying the substrate 12 and a first insulating layer 14 interposed therebetween is provided. An opening 22 is formed in a first region of the silicon-on-insulator structure by removing a portion of the silicon layer 16 and the first insulating layer 14 to expose a portion 24 of the substrate layer 12. Selective epitaxial silicon 30 is grown in the opening. A second insulating layer 40 is formed in the silicon 30 grown in the opening 22 to provide an insulating layer 40 between the grown silicon 30 in the opening 22 and the substrate 12.
机译:提供一种半导体器件,其包括具有第一晶体取向的衬底12和覆盖在衬底12上的绝缘层40。在绝缘层40上形成多个硅层16、30。第一硅层16包括具有第一晶体取向的硅,第二硅层30包括具有第二晶体取向的硅。另外,提供了一种形成具有绝缘体上硅结构的半导体器件的方法,该绝缘体上硅结构包括衬底12,硅层16覆盖衬底12,并且第一绝缘层14介于衬底12之间。通过去除一部分硅层16和第一绝缘层14以暴露出衬底层12的一部分24,在绝缘体上硅结构的第一区域中形成开口22。开幕式。在开口22中生长的硅30中形成第二绝缘层40,以在开口22中生长的硅30和衬底12之间提供绝缘层40。

著录项

  • 公开/公告号EP1815520A1

    专利类型

  • 公开/公告日2007-08-08

    原文格式PDF

  • 申请/专利权人 ADVANCED MICRO DEVICES INC.;

    申请/专利号EP20050812444

  • 发明设计人 WAITE ANDREW M.;CHEEK JON;

    申请日2005-10-12

  • 分类号H01L27/12;H01L21/84;H01L21/762;

  • 国家 EP

  • 入库时间 2022-08-21 20:40:47

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