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vertical type power LED and radiant heat structre of horizontal type LED

机译:垂直型功率LED和水平型LED的辐射热结构

摘要

Disclosed is an effective heat dissipation from a vertical type LED chip packaged by mounting a power chip on the lamp type LED to extend the service life of the component element, It is to minimize the change of characteristics of parts due to heat,;The vertical power LED according to the present invention is a vertical power LED packaged by mounting a power chip on a lamp type LED,;An LED element is seated in a cup recessed recess, and is connected through a conductive wire to supply power to the LED element from outside. and,;A second lead frame connected to the LED element through a conductive wire so as to supply power from the outside, and opposed to the first lead frame;;It includes an LED element and a molded article formed by molding the upper side of the first and second lead frames with a transparent body.;The heat dissipation structure of the horizontal power LED according to the present invention is a heat dissipation structure of a horizontal power LED packaged by mounting a power chip on a lamp type LED.;An LED element is seated in a cup recessed recess, and is connected through a conductive wire to supply power to the LED element from outside. and,;A second lead frame connected to the LED element through a conductive wire so as to supply power from the outside, and opposed to the first lead frame;;A molding including an LED element and molding the upper side of the first and second lead frames with a transparent body;;Bending the first and second lead frame positioned outside the lens to radiate heat generated from the LED element to the outside, and includes a heat sink attached to the bent end of the first and second lead frame.;Heat dissipation structure of lamp, vertical power LED, horizontal power LED, lead frame, heat sink
机译:公开了通过将功率芯片安装在灯型LED上以延长组成元件的使用寿命来封装的垂直型LED芯片的有效散热,这是为了最大程度地减少由于热引起的部件特性变化;根据本发明的功率LED是通过将功率芯片安装在灯型LED上而封装的垂直功率LED; LED元件被安置在杯状凹进的凹口中,并且通过导线连接以向LED元件供电。从外面。第2引线框与第1引线框相对,该第2引线框与第1引线框相对,该第2引线框通过导线与LED元件连接,以从外部供给电源。第一和第二引线框架具有透明的主体。根据本发明的水平功率LED的散热结构是通过将功率芯片安装在灯型LED上而封装的水平功率LED的散热结构。 LED元件位于杯状凹部中,并通过导线连接以从外部向LED元件供电。第2引线框与第1引线框对置,该第2引线框通过导线与LED元件连接而从外部供给电力,并与第1引线框相对。具有透明主体的引线框;将位于透镜外部的第一引线框和第二引线框弯曲,以将从LED元件产生的热量散发到外部,并且包括附接到第一引线框和第二引线框的弯曲端的散热器。灯的散热结构,垂直功率LED,水平功率LED,引线框,散热器

著录项

  • 公开/公告号KR200430803Y1

    专利类型

  • 公开/公告日2006-11-13

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20060022700U

  • 发明设计人 황인혁;

    申请日2006-08-24

  • 分类号H01L33;H01L23/36;H01L23/367;

  • 国家 KR

  • 入库时间 2022-08-21 20:39:00

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