首页> 外国专利> Fabrication process by LIGA type technology, of a monolayer or multilayer metallic structure, and structure obtained therewith

Fabrication process by LIGA type technology, of a monolayer or multilayer metallic structure, and structure obtained therewith

机译:通过LIGA型技术的单层或多层金属结构的制造工艺,以及由此获得的结构

摘要

The manufacture a single/multi layered metallic structure using lithography, electroforming and molding ultraviolet technology, comprises spreading out a photoresist layer on a massive metallic substrate, creating a photoresist mold by irradiation/electronic/ionic bombardment, heating the photoresist layer for evaporating a solvent, exposing the photoresist layer through a mask corresponding to desired imprint under an ultraviolet radiation of 100-2000 mJ/cm 2 measured at a wavelength of 365 nm, and annealing the layer for complete photopolymerization/photodecomposition. The manufacture a single/multi layered metallic structure using lithography, electroforming and molding ultraviolet technology, comprises spreading out a photoresist layer on a massive metallic substrate, creating a photoresist mold by irradiation/electronic/ionic bombardment, heating the photoresist layer for evaporating a solvent, exposing the photoresist layer through a mask corresponding to desired imprint under an ultraviolet radiation of 100-2000 mJ/cm 2 measured at a wavelength of 365 nm, annealing the layer for complete photopolymerization/photodecomposition, developing the layer by dissolution of non- polymerized/photodecomposed parts, galvanically depositing a metal/an alloy in the exposed parts of the photoresist mold, leveling the metal/alloy by a machine to obtain a plane upper surface (2), producing an electroformed mechanical structure on the upper surface of the plane, detaching the metallic structure and the polymerized photoresist massive metallic substrate by delamination, separating the polymerized photoresist from the substrate, placing a fixed object above the massive metallic substrate in a removable way after the step of spreading and heating of the layer, and releasing the object of the massive metallic substrate to obtain the single/multi layered metallic structure with entirely superimposed layers having an inserted object, placing a screw in a threaded hole on the massive metallic substrate, which passes on top of the upper surface of the substrate, and unscrewing the screw to obtain the singe/multi-layered metallic structure with entirely superimposed layers having a threaded hole. The massive metallic substrate has a textured upper surface with micro-beading, mechanical-chemical etching or laser, and a polished upper surface in which the substrate is made up of stainless steel. An independent claim is included for a processed metallic structure.
机译:使用光刻,电铸和紫外线技术制造单层/多层金属结构,包括在大块金属基板上铺展光致抗蚀剂层,通过辐射/电子/离子轰击产生光致抗蚀剂模具,加热光致抗蚀剂层以蒸发溶剂然后,通过在对应于所需压印的掩模下在波长为365 nm的100-2000 mJ / cm 2>的紫外线辐射下曝光光致抗蚀剂层,并对该层进行退火以完成光聚合/光分解。使用光刻,电铸和紫外线技术制造单层/多层金属结构,包括在大块金属基板上铺展光致抗蚀剂层,通过辐射/电子/离子轰击产生光致抗蚀剂模具,加热光致抗蚀剂层以蒸发溶剂然后,在365 nm波长下测得的100-2000 mJ / cm 2的紫外线辐射下,通过对应于所需压印的掩模对光致抗蚀剂层进行曝光,对该层进行退火以完成光聚合/光分解,通过溶解非聚合/光分解的部件,在光致抗蚀剂模具的裸露部分电镀沉积金属/合金,通过机器将金属/合金流平,以获得平坦的上表面(2),在金属/合金的上表面产生电铸机械结构平面,通过德拉米分离金属结构和聚合的光刻胶块状金属基底国家,将聚合的光致抗蚀剂与基板分离,在层的扩散和加热步骤之后,将固定的物体以可移除的方式放置在块状金属基板上方,并释放块状金属基板的物体以获得单层/多层具有完全重叠的层且具有插入对象的金属结构,将螺钉放在块状金属基板上的螺纹孔中,该螺钉穿过基板的上表面顶部,然后拧松螺钉以获得单层/多层金属结构完全重叠的层上有螺纹孔。块状金属基材具有带微珠,机械化学蚀刻或激光的纹理化上表面,以及抛光的上表面,其中基材由不锈钢制成。对于加工的金属结构包括独立权利要求。

著录项

  • 公开/公告号EP1835339A1

    专利类型

  • 公开/公告日2007-09-19

    原文格式PDF

  • 申请/专利权人 DONIAR S.A.;

    申请/专利号EP20060405114

  • 发明设计人 SAUCY CLEMENT;

    申请日2006-03-15

  • 分类号G03F7/00;

  • 国家 EP

  • 入库时间 2022-08-21 20:39:06

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