APPLICATION OF ADHESIVE FOR PRODUCING A STRUCTURE THAT IS RESISTANT TO HIGH-TEMPERATURES

摘要

The invention relates to a method for producing a structure (1), which is resistant to high temperatures and comprises at least one layer (2) that is at least partially structured. The method comprises the following steps: a) application of an adhesive (3) to at least one connecting section (4) of the layer or layers (2), the adhesive (3) being applied in drop form to form an adhesive layer (5) with a layer thickness (6) of less than 0.05 mm; b) at least partial formation of the structure (1); c) application of a solder material (7) in such a way that the latter is fixed at least partially to an adhesive layer (5); d) thermal treatment. The method permits in particular metallic honeycomb structures, such as those that are preferably used in the automotive industry for the treatment of exhaust gas, to be glued and soldered in a precise manner. ® KIPO & WIPO 2007