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WIRING BOARD FOR A LGA TYPE SEMICONDUCTOR DEVICE, A LGA TYPE SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCTION OF WIRING BOARD FOR A LGA TYPE SEMICONDUCTOR DEVICE
WIRING BOARD FOR A LGA TYPE SEMICONDUCTOR DEVICE, A LGA TYPE SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCTION OF WIRING BOARD FOR A LGA TYPE SEMICONDUCTOR DEVICE
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机译:Lga型半导体器件的接线板,LGA型半导体器件以及LGA型半导体器件的接线板的生产过程
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摘要
In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.
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