METHOD FOR THE CATASTROPHIC TRANSFER OF A THIN LAYER AFTER CO-IMPLANTATION

摘要

The catastrophic transfer of a thin film comprises: (a) preparing a source substrate; (b) implanting a first species of ions or gas, in a first dose to a given depth, and a second species of ions or gas in a second dose, the first species being able to generate defects and the second species being able to occupy these defects; (c) applying a stiffener in intimate contact with the source substrate; (d) heat treating the source substrate to a given temperature for a given time, to create a buried fragile zone without initiating the thermal detachment of the thin film; and (e) applying a localized energy contribution to provoke the catastrophic detachment of the thin film delimited between the surface and the buried fragile layer, this thin film having a surface with a rugosity below a given threshold.