ADJUVANT CAPABLE OF CONTROLLING A POLISHING SELECTIVITY AND CHEMICAL MECHANICAL POLISHING SLURRY COMPRISING THE SAME

摘要

An adjuvant capable of controlling a polishing selectivity is provided to enhance a polishing selectivity of silicon oxide film to silicon nitride film, uniformize the sizes of particles in CMP slurry, and minimize micro-scratch to be formed during polishing when applied to CMP slurry. The adjuvant capable of controlling a polishing selectivity is used when a material with a positive charge and a material with a negative charge are polished at the same time. The adjuvant comprises (a) a polymeric acid which adsorbs to the material with a positive charge to enhance a polishing selectivity to the material with a negative charge, (b) a basic material, and (c) a fluorine-based compound. The chemical mechanical slurry includes (a) the adjuvant capable of controlling a polishing selectivity, (b) abrasive particles, and (c) water.