SEMICONDUCTOR MEMORY DEVICE INCLUDING POST PACKAGE REPAIR CIRCUIT AND METHOD OF POST PACKAGE REPAIR

摘要

A semiconductor memory device comprising a post package repair circuit and a post package repair method are provided to perform a repair operation only on a weak cell by preventing repair of normal cells caused when a top array mat and a bottom array mat of one bank are enabled at the same time in order to repair the weak cell. In a semiconductor memory, a plurality of banks includes normal cells and redundancy cells and comprises a plurality of array mats. A repair circuit repairs a weak cell with a redundancy cell corresponding to the weak cell when the weak cell is detected among the normal cells. The repair circuit controls the array mats comprised in one bank differently.