SEMICONDUCTOR MEMORY DEVICE INCLUDING POST PACKAGE REPAIR CONTROL CIRCUIT AND POST PACKAGE REPAIR METHOD

摘要

Semiconductor storage device includes that column packet repair control circuit and a column packet repair method are arranged to reduce production cost, and the expensive test equipment with the memory of a fail bit map will not be used during column guarantees the repair free of charge reason. Semiconductor storage device includes a first memory bank (11), an additional storage bank (13) and a column packet repair control circuit. Compare data read from the first memory bank of the data with application from outside column packet repair control circuit and provide comparison result data to additional storage bank, judges whether to make from the comparison result data read of additional storage bank abnormal data to indicate a fail bit and control according to judge in first memory bank repairing fail memory unit.