首页> 外国专利> Method for forming a photoresist with high resistance to dry etching and method for forming a semiconductor device using the same

Method for forming a photoresist with high resistance to dry etching and method for forming a semiconductor device using the same

机译:形成具有高抗干蚀刻性的光致抗蚀剂的方法以及使用该方法形成半导体器件的方法

摘要

The present invention during the etching process for forming a storage node of the cylinder structure, picture that is used as an etch mask even if the resist pattern is exposed to a plasma etching apparatus for a long time, is to prevent the deformation of the photoresist. Method for manufacturing a cylinder capacitor structure according to the present invention, the transistor is a step of forming an insulating film on the etch stop layer to form an etch barrier layer formed on the semiconductor substrate and the film on the photoresist pattern for a step of forming the insulating Remove the process and the pattern of the insulating film and the etch stop layer as an etch mask for sequentially forming step and the conductive film for the capacitor storage node is formed on the entire surface of the substrate etching step and the capacitor storage node to the UV treatment on the photoresist pattern and comprises a step of forming a capacitor storage node by removing the insulating film by wet etching
机译:本发明在用于形成圆柱结构的存储节点的蚀刻过程中,即使抗蚀剂图案长时间暴露于等离子体蚀刻设备中也用作蚀刻掩模的图片是为了防止光刻胶变形。 。根据本发明的用于制造圆柱电容器结构的方法,该晶体管是在蚀刻停止层上形成绝缘膜以形成形成在半导体衬底上的蚀刻阻挡层和在光致抗蚀剂图案上的膜的步骤,该步骤包括以下步骤:形成绝缘体去除绝缘膜和蚀刻停止层的工艺和图案,作为用于依次形成步骤的蚀刻掩模,并且在衬底蚀刻步骤和电容器存储的整个表面上形成用于电容器存储节点的导电膜。在光致抗蚀剂图案上进行UV处理的节点,并且包括通过通过湿蚀刻去除绝缘膜来形成电容器存储节点的步骤

著录项

  • 公开/公告号KR100669344B1

    专利类型

  • 公开/公告日2007-01-16

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20040094705

  • 发明设计人 정규찬;

    申请日2004-11-18

  • 分类号H01L27/108;H01L21/8242;

  • 国家 KR

  • 入库时间 2022-08-21 20:33:11

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