HIGH RELIABLE EPOXY MOLDING COMPOUND HAVING GOOD FLAME RETARDANCY AND FLOW-ABILITY FOR SEALING ELECTRONIC COMPONENT

摘要

Provided is a non-halogen epoxy resin composition for sealing semiconductor devices, which is superior in flame retardancy, flowability, and reliance, contains no halogen-based and phosphorous flame retardant, and is harmless to people. The epoxy resin composition having good flame retardancy, flowability, and reliance for sealing semiconductor devices consists of an epoxy resin, a hardener, a hardening accelerator, and inorganic filler as indispensable components. The silicon resin flame retardant represented by the following formula 1 is contained in an amount of 0.1-10wt% of the epoxy resin composition. In the formula, R is H or an alkyl group and l, m, and n each is an integer of 1 or greater.