Method of producing heat sink package by rotating jig type plasma thermal spray

摘要

PURPOSE: A method of producing heat sink package by rotating jig type plasma thermal spray is provided to efficiently and economically fabricate a heat sink substrate adaptable to an IC package of a hermetic 4 sided seal type by performing a plasma spraying process using alumina powder. CONSTITUTION: Oxygen free high-conductive copper(OFHC) as a raw material and coating powder are prepared. A grit blasting(G/B) process is performed. The surface of copper is plated. A black oxide process is carried out. A spraying process is performed.