Method for preparing electroconductive particles with improved dispersion and adherence

摘要

The present invention relates to a process for the preparation of the dispersion, and excellent adhesion to conductive electroless plated powder, a little More particularly, the method of manufacturing a conductive powder according to the electroless plating method of forming a metal layer on the substrate surface of the resin powder on the electroless plating solution, the dispersibility and adhesion to the plating layer formed when processing the ultrasound excellent conductive electroless plating relates to a process for the production of the powder. ; without any aggregation phenomenon that occurs when the coated substrate of the resin powder through the electroless plating method according to the present invention, it is possible to plating reaction at a low temperature, adhesion to the dense coating layer and the resin powder and homogeneity This may not only obtain excellent plating the powder, there is no post-treatment process as compared to the prior art, the advantage of this process is a simple process operating costs and by the reaction at a low temperature.