FLEXIBLE PRINTED WIRING BOARD, MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND PORTABLE TELEPHONE TERMINAL USING THE MULTILAYER FLEXIBLE PRINTED WIRING BOARD

摘要

The invention intends to provide a flexible printed wiring board and a multilayer flexible printed wiring board by which, in a method of laminating a substrate having non-adhesive and adhesive sections, adhering of FPC substrates to each other in a bending section may be prevented and sufficient bending strength may be maintained. The invention provides a flexible printed wiring board, having at least an electrical insulating layer and a conducting layer, the electrical insulating layer has a ten point average roughness ranging from 1.5 m or more to less than 2.0 m and a contact angle ranging from 60 DEG or more to less than 120 DEG, or a ten point average roughness ranging from 2.0 m or more to less than 4.0 m. The invention also provides a multilayer flexible printed wiring board wherein two or more flexible printed wiring boards are laminated, in a bendable status, and surfaces of electrical insulating layers of two or more flexible printed wiring boards exposed are opposite to each other in a non-adhesive status, a part of the wiring board is laminated to a first multilayer wiring board and a second multilayer wiring board, respectively.