首页> 外国专利> HIGH IMPEDANCE SURFACE STRUCTURE USING ARTIFICIAL MAGNETIC CONDUCTOR, AND ANTENNA AND ELECTROMAGNETIC DEVICE USING THE SAME STRUCTURE

HIGH IMPEDANCE SURFACE STRUCTURE USING ARTIFICIAL MAGNETIC CONDUCTOR, AND ANTENNA AND ELECTROMAGNETIC DEVICE USING THE SAME STRUCTURE

机译:使用人工磁导体的高阻抗表面结构,以及使用相同结构的天线和电磁设备

摘要

A high impedance surface structure using an artificial magnetic conductor, and an antenna and an electromagnetic device using the same surface structure are provided to reduce a size of a unit cell by overlapping conductors in the unit cell with one another. A high impedance surface structure using an artificial magnetic conductor includes a ground layer(300), a first dielectric layer(200), and a high impedance surface layer(100). The ground layer is composed of a first conductive layer. The first dielectric layer is formed on the ground layer. A second dielectric layer and a second conductive layer are formed on the first dielectric layer. The high impedance surface layer is formed in an inter-digital shape to interpose the second dielectric layers. An AMC(Artificial Magnetic Conductor) property is obtained without using a via to connect between the ground layer and the second conductive layer.
机译:提供了使用人造磁导体的高阻抗表面结构以及使用相同表面结构的天线和电磁装置,以通过使单元电池中的导体彼此重叠来减小单元电池的尺寸。使用人造磁导体的高阻抗表面结构包括接地层(300),第一介电层(200)和高阻抗表面层(100)。接地层由第一导电层组成。第一介电层形成在接地层上。在第一介电层上形成第二介电层和第二导电层。高阻抗表面层形成为叉指状以插入第二介电层。在不使用通孔连接接地层和第二导电层之间的情况下,可以获得AMC(人工磁导体)特性。

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