COPPER OR COPPER ALLOY TARGET/COPPER ALLOY BACKING PLATE ASSEMBLY

摘要

copper or eddy current ( ) in respect to the copper alloy sputtering target characteristics and other magnetron sputtering target balanced properties which are required to be a challenge to provide a balance that copper or copper alloy target / copper alloy backing plate assembly . ; copper or copper alloy using a magnetron sputtering target / copper alloy backing plate assembly as , copper alloy backing plate is low ( ) beryllium copper alloy or Cu-Ni-Si -based alloy of copper or copper alloy target / copper alloy backing plate assembly . Further, the copper alloy backing plate has electrical conductivity 35 ~ 60% (IACS),. Copper or copper alloy target / copper alloy backing plate assembly which includes a 0.2% proof stress 400 ~ 850MPa