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METHOD FOR FORMING HfO2 FILM USING Hf Metal Organic Compound

机译:用H金属有机化合物形成H膜的方法

摘要

ALD method by HfO2 film on to in , Hf source as Si atoms are Hf metal -containing organic matter and use . HfO using the atomic layer deposition method according to the invention 2 film-forming method comprises the steps of adsorbing to the surface of the semiconductor substrate Hf Hf source is supplied to the semiconductor substrate is loaded into the reactor , the first purge gas for the purging of unreacted Hf source and the reaction by-product supplied to the interior of the reactor , by supplying an oxygen source into the reactor within the reactor the step and the second purge gas is reacted with Hf adsorbed on the surface of the semiconductor substrate supplied by the source , but the unreacted oxygen and purging the reaction by-product as one cycle , repeating the cycle more than once by HfO and 2 as to form a film .
机译:ALD法通过在HfO2薄膜上进行,In中的Hf源为Si原子,是含Hf金属的有机物而使用。 HfO 使用根据本发明的原子层沉积方法2 的成膜方法包括以下步骤:将Hf吸附到半导体衬底的表面上,将Hf源供应给半导体衬底,装入反应器中,第一吹扫气体用于净化未反应的Hf源和供应到反应器内部的反应副产物。源提供的半导体衬底表面,但未反应的氧气和清除反应副产物为一个循环,用HfO 和2 重复一次以上,以形成薄膜。

著录项

  • 公开/公告号KR100766007B1

    专利类型

  • 公开/公告日2007-10-10

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030078676

  • 发明设计人 신철호;박찬호;조병하;김대식;

    申请日2003-11-07

  • 分类号C23C16/28;

  • 国家 KR

  • 入库时间 2022-08-21 20:31:12

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