ELECTRODEPOSITED COPPER FOIL WITH LOW ROUGHNESS SURFACE AND PROCESS FOR PRODUCING THE SAME

摘要

surface roughness Rz has a rough surface relief was uniformly low light without the uneven , yet less angry 2.0 , in addition, the electrodeposited copper foil surface is low elongation at 180 10.0% or more . The low surface electrodeposited copper foil is , sulfuric acid- copper sulfate aqueous solution as an electrolytic solution , and the back metal element or the drum by using a titanium insoluble anode and a cathode opposite to an anode made of a titanium plate coated with the oxide elements , and the anode in the production method of the electrodeposited copper foil for passing a direct current between a cathode , wherein the polyoxyethylene -based surfactant in the electrolyte solution , a polyethyleneimine or derivative thereof , can be obtained by the presence of chloride ion and a sulfonate of active organic sulfur compound .