FLUX PIN HOLE PLATE FOR SEMICONDUCTOR MANUFACTURING APPARATUS USING MEMS TECHNOLOGY AND FLUX PIN HOLE PLATE USING SAME

摘要

A method of manufacturing a flux pin hole plate using MEMS(MicroElectroMechanical System) technology and the flux pin hole plate manufactured by the same are provided to form a through-hole in high precision by using etching processes. A substrate(20) is washed, and then an etch stop layer(22) is formed on upper and lower surfaces of the substrate. A photoresist is applied on the etch stop layer formed on the upper surface to form a photolithography layer(23). The photolithography layer is subjected to an exposure process by using a mask(24), and then is developed to form a mask pattern. The exposed etch stop layer is subjected to dry etching, and then the exposed substrate is subjected to wet etching to form a through-hole.