A method for testing a plurality of components on a wafer with a common data line and a common supply line

摘要

A method for testing a plurality of components (108, 110, 112, 114) on a wafer (100) are arranged, and with a common data line (118) and with a common supply line (122) are connected, in which the components (108, 110, 112, 114) via the common data line (118) with a test device (116) are connectable, and the components (108, 110, 112, 114) via the common supply line (122) can be acted upon with a supply output level, with the following steps:(a) determining faulty components (112) on the wafer (100);(b) separation of a compound (112a) between a defective component (112) and the common data line (118);(c) supplying all components (108, 110, 112, 114) with a supply output level via the common supply line (122) during the testing operation in the following step (d), in order to ensure a uniform temperature distribution on the wafer (100) and to reaching(d) testing of the remaining, not - faulty components (108, 110, 114).