Electronic unit e.g. thin-film transistor, manufacturing method, involves pressing semiconducting layer of output structure toward conducting layer of another structure, such that embossed structure cuts off and intercepts conducting layer

摘要

The method involves providing a multi-layer level output structure with an electrically conducting layer (3) arranged on a substrate (2), an embossing layer (4) made of electrically isolating material with an embossed structure and an electrically semiconducting layer arranged on the embossing layer and embossed structure. The semiconducting layer is pressed toward another electrically conducting layer of another level output structure, such that the embossed structure coated with electrically semiconducting material cuts off and intercepts the latter conducting layer in sections. An independent claim is also included for a multilayer level output structure utilized in a method of manufacturing an electronic unit.