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Banknotes checking apparatus for use in banknote processing machine, has sensor connected to flexural resistant carrier via adhesive layer, where carrier is connected to component of apparatus via another elastic adhesive layer
Banknotes checking apparatus for use in banknote processing machine, has sensor connected to flexural resistant carrier via adhesive layer, where carrier is connected to component of apparatus via another elastic adhesive layer
The apparatus has a sensor for detecting information that characterizes the banknotes to be checked. The sensor is connected to a flexural resistant carrier via an adhesive layer (20), where the carrier is connected to a component e.g. housing, of the apparatus via another elastic adhesive layer (40) and/or is directly connected to a banknote processing machine. The sensor is made from a semiconductor material e.g. gallium arsenide.
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