A method for assembling of semiconductor chips and corresponding half conductor chip arrangement

摘要

The present invention provides a method for mounting semiconductor chips with the steps of: providing a semiconductor chip (4) with a front side (vs), a membrane area (4a) and a peripheral region (5), and a rear side (rs), which provides a the diaphragm region (4a) adjacent cavity (4c); providing a substrate (1) comprising a hole (1a); mounting of the rear side (rs) of the semiconductor chip (4) on the substrate (1), in such a way that the cavern (4c) with the passage opening (1a) in fluid communication; and at least partial filling of the cavern (4c) with a passivation gel (10) through the passage opening (1a). The present invention provides also a corresponding half conductor chip arrangement.