A magnetron sputter process - and - a magnetron sputtering apparatus

摘要

A magnetron - sputtering processes, comprising:The sputtering process carried out by generating a magnetron - discharge in the vicinity of a plurality of targets, wherein the targets are arranged close to one another, so that immediately the adjacent targets to be arranged opposite one another, wherein each target in a vacuum atmosphere is electrically independent, andApplication of voltages with a phase difference of 180 degrees to the adjacent targets in a predetermined timing during the sputtering process.