Flip chip bonding fabricating method for semiconductor component, involves hardening of bumps after applying two-stage adhesive, and applying die with bumps made of hardened adhesive on substrate by contact of bumps with substrate contact

摘要

The method involves connecting a contact (4) of a die with a contact of a substrate by electrically conducting bumps that are made of conducting adhesives (7). The bumps are applied on the contact of the die by an electrically conducting two-stage hardened adhesive. The bumps are hardened after applying the adhesive in a stage, and the die with the bumps made of the hardened adhesive is applied on the substrate by contact of the bumps with the contact of the substrate. The adhesive is hardened during manufacturing of an adhesive connection between the die and the substrate in another stage. Independent claims are also included for the following: (1) a substrate for implementing a flip chip bonding method (2) a semiconductor component with a die.