Electronic component e.g. power semiconductor module, transporting/packing container, has molded body forming tub and another molded body forming cavities for respective components, where each cavity has wall, base and support devices

摘要

The container has molded bodies (1, 2), where the molded body (1) forms a tub (10) and the molded body (2) forms a number of cavities (20) for respective electronic components (4) e.g. power semiconductor module. Each of the cavities has a wall (24), a base (22), and support devices (220, 240) for partially supporting the electronic components. The cavities are arranged inside the tub, where the molded bodies include a plastic foil. An intermediate layer is arranged between a base (12) of the tub and the respective bases of the cavities.