首页> 外国专利> Micrometer and submicrometer surface height measuring apparatus for semiconductor fabrication, has spectrometer analyzing wavelength composition of light returning through coupler, and microscope providing over view of surface

Micrometer and submicrometer surface height measuring apparatus for semiconductor fabrication, has spectrometer analyzing wavelength composition of light returning through coupler, and microscope providing over view of surface

机译:用于半导体制造的微米和亚微米表面高度测量设备,具有用于分析通过耦合器返回的光的波长成分的光谱仪,以及提供表面视野的显微镜

摘要

The apparatus has a chromatic confocal height sensor with a light source transmitting light through a fiber optic coupler and through an afocal dispersive lens (5) and an objective lens onto a submicrometer surface. A spectrometer (2) analyzes a wavelength composition of light returning through the coupler to measure trench depth. A microscope provides an over view of the surface to measure the trench depth. An independent claim is also included for a method for measuring height characteristic in a submicrometer surface.
机译:该设备具有彩色共焦高度传感器,其具有光源,该光源将光通过光纤耦合器,通过无焦点分散透镜(5)和物镜将光传输到亚微米表面上。光谱仪(2)分析通过耦合器返回的光的波长组成,以测量沟槽深度。显微镜提供了该表面的俯视图,以测量沟槽深度。还包括用于测量亚微米表面中的高度特征的方法的独立权利要求。

著录项

  • 公开/公告号DE102006050834A1

    专利类型

  • 公开/公告日2007-06-21

    原文格式PDF

  • 申请/专利权人 TAMAR TECHNOLOGY INC.;

    申请/专利号DE20061050834

  • 发明设计人 MARX DAVID S.;GRANT DAVID L.;

    申请日2006-10-27

  • 分类号G01B11/02;G01B11/22;G02B21;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:13

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