Solder ball-mounting device, has upper limit and lower limit sensors determining whether amount of solder balls reaches upper or lower limit in ball socket when movement device moves mask and ball socket relative to each other

摘要

The device has a movement device moving a ball socket (8) relatively along an upper surface of a ball arrangement mask and dropping solder balls in ball insertion parts of the mask. Upper limit sensors (22A, 22B) and lower limit sensors (23A, 23B) determine whether the amount of balls reaches an upper limit or a lower limit in the socket, when the movement device moves the mask and the socket relative to each other. Leakage sensors (25A, 25B) detect leakage of the balls from an intermediate space between the socket and the mask on a rear side in a relative movement direction of the socket.