首页> 外国专利> Integrated semiconductor fuse component for e.g. programmable read only memory, has conducting layer formed on polysilicon layer with small thickness in part of its extension on connection path than in another part of its extension on path

Integrated semiconductor fuse component for e.g. programmable read only memory, has conducting layer formed on polysilicon layer with small thickness in part of its extension on connection path than in another part of its extension on path

机译:集成半导体保险丝组件,例如可编程只读存储器,具有在多晶硅层上形成的导电层,该导电层的厚度在连接路径上的延伸部分比在路径上延伸的另一部分小

摘要

The component has a polysilicon layer (22) with an anode (24), a cathode (23), and a fuse connecting path. A conducting layer (21) formed on the polysilicon layer has a small thickness in a part of its extension on the fuse connection path than in another part of its extension on the fuse connecting path, where the conducting layer is a metal silicide layer. The path has a doped polysilicon area (26) arranged adjacent to the anode and the cathode, and another doped polysilicon area (27) arranged in a middle area of the fuse connecting path between the anode and the cathode. An independent claim is also included for a procedure for producing an integrated semiconductor fuse component.
机译:该部件具有带有阳极(24),阴极(23)和熔丝连接路径的多晶硅层(22)。形成在多晶硅层上的导电层(21)在其在熔丝连接路径上的延伸部分的厚度小于在其在熔丝连接路径上的延伸部分的另一部分中的厚度,其中,导电层是金属硅化物层。该路径具有邻近阳极和阴极布置的掺杂的多晶硅区域(26),以及布置在阳极和阴极之间的熔丝连接路径的中间区域中的另一个掺杂的多晶硅区域(27)。还包括用于制造集成半导体熔丝组件的程序的独立权利要求。

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