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method and device for drahtbonden drahtbonden, halbleitervorrichtung
method and device for drahtbonden drahtbonden, halbleitervorrichtung
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机译:引线键合的方法和装置,半导体装置
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摘要
A wire bonding method comprising: disposing a plurality of leads (20) aligned in an imaginary plane (P) around the periphery of a semiconductor chip (10) having a plurality of electrodes (12) aligned on an imaginary straight line (L1); bonding wires (30) to the electrodes (12); bending the wires (30) toward the leads (20) as viewed from a direction perpendicular to the imaginary plane (P); and bonding the wires (30) to the leads (20). IMAGE
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