A process for the preparation of a substrate in particular for the optical, electronic or opto-electronic applications and resulting substrate

摘要

The invention concerns a method for making substrates, in particular for optics, electronics or optoelectronics. The method comprises steps which consist in: transferring a seed layer (2) onto a support (12) by molecular adhesion at the bonding interface; epitaxial growth of a useful layer (16) on the seed layer, and applying stresses to produce removal of the formed assembly from the seed layer (2) and the useful layer (16) relative to the support (12) at the bonding interface.