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zu00fcchtungsverfahren a iii - v compound semiconductors and manufacturing process for a nitride - part

机译:z iii-v化合物半导体及其氮化物的制造工艺-一部分

摘要

When making a growth mask on a substrate and using the growth mask to selectively grow nitride III-V compound semiconductors on the substrate, a multi-layered film including a nitride forming at least its top surface is used as the growth mask. The growth mask may be combination of an oxide film and a nitride film thereon, combination of a metal film and a nitride film thereon, combination of an oxide film, a film thereon made up of a nitride and an oxide, and a nitride film thereon, or combination of a first metal film, a second metal film thereon different from the first metal film and a nitride film thereon, for example. The oxide film may be a SiO2, for example, the nitride film may be a TiN film or a SiN film, the film made up of a nitride and an oxide may be a SiNO film, and the metal film may be a Ti film or a Pt film, for example. IMAGE
机译:当在基板上制造生长掩模并使用该生长掩模在基板上选择性地生长氮化物III-V族化合物半导体时,包括至少形成其顶表面的氮化物的多层膜用作生长掩模。生长掩模可以是其上的氧化膜和氮化物膜的组合,其上的金属膜和氮化物膜的组合,氧化物膜的组合,其上由氮化物和氧化物构成的膜以及其上的氮化物膜的组合。例如,或第一金属膜,其上不同于第一金属膜的第二金属膜和其上的氮化物膜的组合。氧化膜可以是SiO 2,例如,氮化膜可以是TiN膜或SiN膜,由氮化物和氧化物构成的膜可以是SiNO膜,金属膜可以是Ti膜或SiN膜。例如Pt胶片。 <图像>

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