New structure for microelectronics and domain and advantages of

摘要

Production of a structure, incorporating a superficial layer (2), at least one buried layer and a support, comprises : (a) the production of a first structure comprising the formation, on a first support (6), of a first layer (4) of a first material and, in this first layer, of at least one zone (26, 28) of a second material presenting a different engraving speed to that of the first material; (b) the formation of the superficial layer by assembling the first structure with a second support. An independent claim is also included for a device incorporating a superficial layer, at least one buried layer and a support.