Electronic component e.g. zinc oxide varistor, thermal protection device for e.g. class III protector, has metal plate bonded on varistor to act as heat sink, and fusing element cut by projection when its temperature reaches melting point

摘要

The device has a metal plate (3) that is bonded on a varistor (4), where the plate acts as a heat sink and has a thickness of 1mm. A fusing element (2) acts as a normal fuse. The element melts and is cut by projection, when its temperature reaches its melting point. The element melts if current intensity exceeds its limited capacity, in case of occurrence of a short-circuit in a protector formed of varistors.