Interconnection structure formation for integrated circuit, involves consuming and eliminating part of organic material via porous layer by using enzymes and proteins, and heating substrate for ending reaction of material consumption

摘要

The process involves forming a layer with conducting zones (24), made of copper, and insulating zones (26), made of organic material, on a substrate. The layer is covered by a porous layer (28), where the porous layer is a derivative of ethylene phthalate. A part of the organic material is consumed and eliminated via the porous layer by using enzymes and proteins, where the organic material has a polysaccharide or proteinic nature. The substrate is heated or UV radiation is directed towards the substrate for ending a reaction of the consumption of the material. An independent claim is also included for a connection structure comprising a layer with conducting zones.