Mechanochemical polishing composition useful to polish layers applied on semiconductor microcomponent substrates, comprises alkylxanthate, abrasive particles, metal oxidizing agent, chemical agent to attack metals, pH regulator and solvent

摘要

Mechanochemical polishing composition comprises alkylxanthate, abrasive particles made up of metallic oxide, metal oxidizing agent, a chemical agent for attacking metals, optionally, a corrosion inhibitor, a pH regulation agent and a solvent. Independent claims are included for: (1) the preparation of the mechanochemical polishing composition solubilization of the metal oxidizing agent, the chemical agent of attacking metals, the alkylxanthate and the corrosion inhibitor, in a solvent, addition of the obtained solution in a suspension of a metallic oxide e.g. concentrated to 20 wt.% in weight, for two hours, under strong agitation and addition of the pH regulation agent with the obtained mixture to adjust the pH of the solution between 2-10, and preferably 3-7; (2) a mechanochemical polishing composition obtained by the process; and (3) the use of the polishing composition for mechanochemical polishing of layers applied on a substrate carrying at least a semiconductor microcomponent.