首页> 外国专利> COMPOSITION FOR HEAT RADIATION SILICONE GEL AND HEAT RADIATION SILICONE SHEET OBTAINED BY CURING THE SAME

COMPOSITION FOR HEAT RADIATION SILICONE GEL AND HEAT RADIATION SILICONE SHEET OBTAINED BY CURING THE SAME

机译:导热硅酮凝胶的组成和因固化而得到的导热硅脂片

摘要

PROBLEM TO BE SOLVED: To provide a composition for heat radiation silicone gel which has excellent heat radiation properties, can control physical stress, reduces oozing of a liquid silicone, and becomes to gel to exhibit excellent adhesion and tackiness to each part and a substrate when used in electrical/electronic parts, and a heat radiation silicone sheet obtained by curing the composition.;SOLUTION: The composition for curable heat radiation silicone gel comprises an alkenyl group-containing polyorganosiloxane, a diorganohydrogensiloxy-terminated polyorganosiloxane as a chain extender, a polyorganohydrogensiloxane as a crosslinking agent, a hydrosilylation catalyst, and a heat conductive filler, and the ratio of the number of alkenyl groups bonded to the silicon atom in the alkenyl group-containing polyorganosiloxane, the number of hydrogen atoms bonded to the silicon atom in the chain extender, and the number of hydrogen atoms bonded to the silicon atom in the crosslinking agent is specified, and the heat radiation silicone sheet is obtained by curing the composition for heat radiation silicone gel.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种散热性优异的硅酮散热用组合物,可以控制物理应力,减少液态硅酮的渗出,并且在凝胶化时对各部位和基材表现出优异的粘合性和粘性。解决方案:用于可固化的热辐射硅凝胶的组合物包含含烯基的聚有机硅氧烷,二有机氢甲硅烷氧基封端的聚有机硅氧烷作为扩链剂,聚有机氢硅氧烷作为交联剂,氢化硅烷化催化剂和导热性填料,以及在含烯基的聚有机硅氧烷中与硅原子键合的烯基数与链中与硅原子键合的氢原子数之比。填充剂,以及在交联剂中与硅原子键合的氢原子数指定,并通过固化用于散热硅凝胶的组合物获得散热硅树脂片。;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008143980A

    专利类型

  • 公开/公告日2008-06-26

    原文格式PDF

  • 申请/专利权人 WACKER ASAHIKASEI SILICONE CO LTD;

    申请/专利号JP20060330797

  • 发明设计人 KAMIYA MASATO;MATSUMOTO MAKOTO;

    申请日2006-12-07

  • 分类号C08L83/07;C08L83/05;C08K3/00;C09K5/08;

  • 国家 JP

  • 入库时间 2022-08-21 20:25:20

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