首页> 外国专利> ELECTRIC WIRE COMPOSITE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR, ELECTRICAL WIRE PART AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

ELECTRIC WIRE COMPOSITE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR, ELECTRICAL WIRE PART AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

机译:电线复合印刷线路板及其制造方法,电线零件及其制造方法以及电子设备

摘要

PPROBLEM TO BE SOLVED: To provide an electric wire composite printed wiring board that can be made small-sized and the thickness and be arranged freely in three-dimensional manner and high in reliability of connections between an electric wire part and a second conductor layer pattern, and its manufacturing method, and to provide an electric wire part applicable for the electric wire compound printed wiring board and its manufacturing method, as well as, an electronic device to which an electric wire composite printed wiring board is mounted. PSOLUTION: The electric wire compound printed wiring board 1 is provided with a first wiring board 10, having a first insulation substrate and a first conductor layer pattern, an electric wire part 30 that is arranged aside the first wiring board 10, and a second wiring board 20, provided with a second insulation substrate 20 stacked on the first wiring board 10 and a second conductor pattern 22p, connected to the electric wire part 30. The board is also provided with a seat for a wire that is connected to a wire 31c and a connector for a wire, having a projection 32b for a wire that penetrates a second insulation substrate formed integrally with the seat for the wire and is brought into contact with the second conductor layer pattern 22p. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:

要解决的问题:提供一种电线复合印刷电路板,该电线复合印刷电路板可以被制成尺寸和厚度小并且可以以三维方式自由布置并且电线部分与第二部分之间的连接可靠性高。导体层图案及其制造方法,以及提供适用于电线复合印刷线路板的电线部件及其制造方法,以及安装有电线复合印刷线路板的电子设备。

解决方案:电线复合印刷线路板1包括:第一线路板10,其具有第一绝缘基板和第一导体层图案;电线部分30,其布置在第一线路板10旁边;以及第二接线板20,其具有堆叠在第一接线板10上的第二绝缘基板20和连接到电线部分30的第二导体图案22p。该接线板还设置有用于与电线连接的电线座。电线31c和用于电线的连接器具有用于电线的突起32b,该突起32b穿过与电线的座一体形成的第二绝缘基板并与第二导体层图案22p接触。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2008192702A

    专利类型

  • 公开/公告日2008-08-21

    原文格式PDF

  • 申请/专利权人 SHARP CORP;

    申请/专利号JP20070023406

  • 发明设计人 KASHIO HITOSHI;

    申请日2007-02-01

  • 分类号H05K3/46;H01R24/02;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:56

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