首页> 外国专利> CONTOUR-SHEAR VIBRATING CHIP, CONTOUR-SHEAR VIBRATION DEVICE AND METHOD OF MANUFACTURING THE CONTOUR-SHEAR VIBRATING CHIP

CONTOUR-SHEAR VIBRATING CHIP, CONTOUR-SHEAR VIBRATION DEVICE AND METHOD OF MANUFACTURING THE CONTOUR-SHEAR VIBRATING CHIP

机译:轮廓剪切振动芯片,轮廓剪切振动装置和制造轮廓剪切振动芯片的方法

摘要

PROBLEM TO BE SOLVED: To provide a contour-shear vibrating chip and a contour-shear vibration device in which influence of supporting a vibrating part is reduced, and a method of manufacturing the contour-shear vibrating chip.;SOLUTION: The contour-shear vibrating chip 10 includes a vibrating part 12 which performs contour-shear vibration. When a dimension ratio of a longitudinal side and a lateral side constituting an edge 14 of the vibrating part 12 is changed in the vibrating part 12, the position of a node of vibration is changed, such that the position of the node is set as a support position. In the contour-shear vibrating chip 10, a node can be disposed at the edge 14 of the vibrating part 12 by specifying the dimension ratio. Namely, the support position is located at the edge 14 of the vibrating part 12. At such a time, a supporting part 18 that supports the vibrating part 12 is provided at the support position, and the vibrating part 12 and the support part 18 can be integrally formed.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种轮廓剪切振动芯片和轮廓剪切振动装置,其中减少了支撑振动部件的影响,并且提供了一种轮廓剪切振动芯片的制造方法。振动片10包括进行轮廓剪切振动的振动部12。当在振动部分12中改变构成振动部分12的边缘14的纵向侧和横向侧的尺寸比时,改变振动节点的位置,从而将节点的位置设置为支持职位。在轮廓剪切振动芯片10中,通过指定尺寸比,可以在振动部12的边缘14处设置节点。即,支撑位置位于振动部12的边缘14处。此时,在支撑位置设置有支撑振动部12的支撑部18,振动部12和支撑部18能够版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008228195A

    专利类型

  • 公开/公告日2008-09-25

    原文格式PDF

  • 申请/专利权人 EPSON TOYOCOM CORP;

    申请/专利号JP20070067109

  • 发明设计人 YAMADA AKINORI;

    申请日2007-03-15

  • 分类号H03H9/19;H03H3/02;H01L41/18;H01L41/09;H01L41/22;

  • 国家 JP

  • 入库时间 2022-08-21 20:25:00

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