PHOTOSENSITIVE POLYIMIDE COMPOSITION, PREPARATION METHOD OF SOLUBLE POLYIMIDE RESIN AND PREPARATION METHOD OF PHOTOSENSITIVE POLYIMIDE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive polyimide composition which is capable of forming a protective film that hardly deteriorates in a gold plating process and exerts a sufficient adhesion to a copper foil, retains a developability equivalent to those in conventional techniques and hardly causes problems such as residues, a preparation method of a soluble polyimide resin used as a component thereof, and a preparation method of the photosensitive polyimide composition.;SOLUTION: The photosensitive polyimide composition contains the soluble polyimide resin and a positive sensitizer, provided that the soluble polyimide resin is a condensation product of an aromatic tetracarboxylic acid dianhydride and a diamine, and the diamine comprises a silicone diamine and a diamine having a hydroxyl group. The weight average molecular weight of the soluble polyimide resin is 20,000-50,000 and exerts a unimodal molecular weight distribution with a variance of ≤2.0.;COPYRIGHT: (C)2008,JPO&INPIT