ELECTROLYTIC LIQUID FOR ELECTROLYTIC POLISHING AND ELECTROLYTIC POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a machined surface having high flattening characteristics while ensuring a higher processing rate for an conductive material with a low voltage applied, and to remove an unnecessary conductive material and expose a barrier film without causing dishing, erosion, or etching at the interface between the barrier film and a metal (conductive material) in polishing of a conductive material such as copper formed on a surface of a substrate in a semiconductor manufacturing process in particular.;SOLUTION: The electrolytic liquid for use in electrolytic polishing for polishing a conductive material on a surface of a polishing object comprises an aqueous solution containing at least one organic acid or its salt, at least one strong acid having a sulfonic acid group, a corrosion inhibitor, and a water-soluble polymeric compound.;COPYRIGHT: (C)2008,JPO&INPIT